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Traction Power System Capacity Limitations at Various Traffic Levels

The aim, and main contribution, of this paper is to propose a fine-tuned fast approximator, based on neural networks, that uses aggregated traction system information as inputs and outputs. This approximator can be used as an Continue reading

Optimal PowerFlow (OPF) Model with Unified AC-DC Load Flow and Optimal Commitmentfor an AC-catenary Railway Power Supply System (RPSS) fed by a High Voltage DC (HVDC) Transmission Line

In this paper an alternative railway power systems design based on an HVDC feeder is studied. The HVDC feeder is connected to the catenary by Continue reading

Event-triggered Control of Multi-agent Systems: Pinning Control, Cloud Coordination, and Sensor Coverage

A multi-agent system is composed of interconnected subsystems, or agents. In control of multi-agent systems, the aim is to obtain a coordinated behavior of the overall system through local interactions among the Continue reading

Compressive Quantization for Scalable Cloud Radio Access Networks

With the proliferation of new mobile devices and applications, the demand for ubiquitous wireless services has increased dramatically in recent years. The explosive growth in the Continue reading

Architectural-Physical Co-Design of 3D CPUs with Micro-Fluidic Cooling

The performance, energy efficiency and cost improvements due to traditional technology scaling have begun to slow down and present diminishing returns. Underlying reasons for Continue reading

Radio Frequency Superconducting Quantum Interference Device Meta-atoms and Metamaterials: Experiment, Theory, and Analysis

Metamamterials are 1D, 2D or 3D arrays of articial atoms. The articial atoms, called “meta-atoms”, can be any component with tailorable electromagnetic properties, such as Continue reading

Physical Design Methodologies for Low Power and Reliable 3D ICs

As the semiconductor industry struggles to maintain its momentum down the path following the Moore’s Law, three dimensional integrated circuit (3D IC) technology has emerged as Continue reading